Implementation and packaging technology of MEMS devices and improvement of reliability.
★How to enhance reliability in terms of joint distortion and joint strength!? ★Increase reliability through semiconductor integration!
Speaker Part 1: Toshiba Corporation, Research and Development Center, Advanced BEOL Technology Development Department, Responsible Person Part 2: Misuzu Industries Co., Ltd., Responsible Person Part 3: Koga Research Institute Sensor Consultant / Part-time Lecturer at Ibaraki University / Industry-Academia-Government Collaboration Coordinator, Ph.D. Tomo Shimada Target Audience: Engineers and researchers related to MEMS devices and microfabrication processes Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 1 [Tokyo, Nihonbashi] Access: 4 minutes from Exit B3 of Higashi-Nihonbashi Station on the JR Toei Asakusa Line, towards Asakusabashi/ Oshiage Date and Time: December 22, 2011 (Thursday) 11:00 AM - 4:00 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 51,450 yen (including tax and text fee) for 2 people from one company *Limited to Tech-Zone members who apply by December 8. Membership registration is free. *After December 8, the [Regular Price] will be 54,600 yen (including tax and text fee) for 2 people from one company.
- Company：AndTech
- Price：10,000 yen-100,000 yen
